Feature

Aluminum nitride parts can be provided in various shapes.

①Excellent in Thermal conductivity, Thermal emissivity (heat dissipation), Thermal shock resistance, Electrical insulation.
②Size that meets needs even in small volume can be provided by CIP mold + Slicing method.
③More than 0.15mm thickness can be provided.

Purpose

LD sub-mount, insulation of circuit substrate, resin for semiconductor encapsulation, heat dissipation sheet and heat dissipation substrate.

Characteristic table